Taiyo-Yuden - Capacitors, Inductors and Other Electrical Components for Cellular Phones

Taiyo Yuden is a leading manufacturer and supplier of electric component technology. The company produces a wide range of products specifically suited to cellular phones, such as multilayer capacitors, multiplayer and wound chip inductors and multiplayer chip ferrite beads.

CFCAP® - LOW DISTORTION MULTILAYER CERAMIC CAPACITORS

The super low distortion multilayer ceramic capacitors CFCAP® were uniquely developed to offer superior thermal resistance, generate little noise when subjected to shocks and offer greater stability.

CFCAP® capacitors use a specially developed material that ensures capacitance-temperature characteristics, voltage characteristics and super low distortion, while also applying thin-layer and multilayer technologies to achieve the high capacitance demanded by the market.

Taiyo Yuden has added the new EIA 0402 size (1.0mm x 0.5mm x 0.5mm) capacitor to the CFCAP® range, joining the existing 1206, 0805, and 0603 case sizes. This new product is ideal for cell phones and other mobile devices where mounting space for parts is severely limited.

COMPACT MULTILAYER CHIP INDUCTORS FOR HIGH-FREQUENCY CIRCUITS

Taiyo Yuden has added new products items in 0201 case size to its range of high-frequency multilayer chip inductors, which achieve the highest inductance value in the industry. With this latest expansion of the series line-up, the 0201 size high-frequency multilayer chip inductors achieve inductance values of 68nH, 82nH, and 100nH, opening up a bigger lead than ever on any rivals.

High-frequency multilayer chip inductors are widely used in cell phone circuits, power amplifiers, VCOs, and other modules mounted in cell phones. The trend for increasingly compact cell phones means that the shift to the 0201 size is already in progress.

WOUND CHIP INDUCTORS

Taiyo Yuden has added two types of 3mm² low-profile power inductors to its NR series of inductors, going along with the 4mm² type currently winning plaudits in the marketplace, achieving the industry's highest allowable current among equivalent sizes.

With mobile equipment becoming ever smaller, industry demand for more compact parts used in these devices is rising. Inductor requirements, for example, include further reductions in size, and a height that does not protrude beyond that of surrounding parts (such as ICs and capacitors), or in other words, a low profile.

In addition, mobile devices are simultaneously becoming both multi-functional and more advanced in function, in such areas as more advanced camera features and color LCDs, so that parts used in mobile devices need to bear with ever higher current to operate.

This multi-functionality also means that various control ICs, utilizing different voltages, are required within a single device. As a result, the number of power inductors required within a single device is rising in response to the multiplication of functions. Taito Yuden's wound chip inductors, with their ability to maintain high current in a compact size, are perfectly suited to this trend toward more compact, multi-function devices.

MULTILAYER CHIP FERRITE BEADS

Taiyo Yuden has added a new EIA 0201 size product to its leading range of multilayer chip ferrite beads.

In cellular phones, use of the ultra-compact 0201 size components mounted on boards, or inside power amplifiers, camera modules and LCD modules is progressing so as to make phones smaller and boost performance in areas such as the number of camera pixels, the size and resolution of the camera's LCD screen and playing movie clips.

With the 0201 size, Taiyo Yuden has achieved the top product line-up in the industry, and is ready for serious entry into the ultra-compact market.

WORLD'S SMALLEST 100µF MLCC

Taiyo Yuden has further extended its MK series to include the 100µF MLCC in 1210 case size and the ultra miniature 100 nF in 0201 case size. The range features Taiyo Yuden's advanced technology which permits a technical level of 1 micron dielectric layers.

• New 100µF in 1210 chip
• Ultra-small 100nF chip in 0201 size
• Very low ESR & ESL
• Polarity-free, low loss and high noise absorption
• High reliability, small size and low cost
• Values from 0.022µF to 100µF and 4VDC to 50VDC
• Perfect for bypass and decoupling applications